Learn more about the latest products presented by Molex and available at Heilind!
1.20mm Wire-to-Board Pico-EZmate and Pico-EZmate Slim low-profile connectors support automated assembly processes, in tight-spaced applications.
Industries in general have been moving towards ever shrinking module sizes and this lends pressure on component makers for reduced size interconnect solutions.
The Pico-EZmate 1.20mm connector system meets this need with mated-heights of 1.55mm and 1.65mm.
The Pico-EZmate Slim connector system introduces an even lower mated-height of 1.20mm and provides customers the needed speed in their pick-and place operations, as well has higher circuit size variants that pass multiple test cycles.
Wire-to-Board Connectors
Pitch:
1.20mm
Mated Height:
1.20, 1.55, 1.65
Current:
2.5A (AWG 28)
Telephone: +49 8024 9021 300
Fax: +49 8024 9021 444
E-mail: vertrieb(at)heilind.com