Pico-EZmate and Pico-EZmate Slim Wire-to-Board Connector Systems

Molex Pico EZmate

1.20mm Wire-to-Board Pico-EZmate and Pico-EZmate Slim low-profile connectors support automated assembly processes, in tight-spaced applications.

Industries in general have been moving towards ever shrinking module sizes and this lends pressure on component makers for reduced size interconnect solutions.

The Pico-EZmate 1.20mm connector system meets this need with mated-heights of 1.55mm and 1.65mm.

The Pico-EZmate Slim connector system introduces an even lower mated-height of 1.20mm and provides customers the needed speed in their pick-and place operations, as well has higher circuit size variants that pass multiple test cycles.

Benefits:

  • Vertical mating offers fast, fool-proof mating without the possibility of wrong orientation or mismating
  • Ultra low-profile mated heights enables easy fitting for vertical space savings
  • Polarizing key prevents mismating
  • Open space on header accommodates pick-and-place
  • Open-top receptacle header
  • Snap-in mating for speedy assembly processing

Video

Molex Pico EZmate Slim Wire to Board System

Category

Wire-to-Board Connectors


Pitch:

1.20mm

Mated Height:

1.20, 1.55, 1.65

Current:
2.5A (AWG 28)

Your expert on Molex solutions

Stefan Schumacher

Product Manager
E-Mail: sschumacher(at)heilind.eu

Contact us

Heilind Electronics Europe

Heilind Electronics GmbH

Telephone: +49 8063 8101 100
Fax: +49 8063 8101 222
E-Mail: vertrieb(at)heilind.eu

Heilind Electronics SP. zo.o.

Telephone: +48 662 703 050
Fax: +49 8063 8101 222
E-Mail: info_cee(at)heilind.eu